Objective and Areas of Interest
You are cordially invited to participate in the 3rd International Conference on Ambient Intelligence and Ergonomics. The conference objective is to provide an international forum for the dissemination and exchange of scientific information on theoretical, generic, and applied areas of ambient intelligence and ergonomics, including their theories and applications in safety, healthcare, digital human modeling, affective and pleasurable design, advanced manufacturing system, future product design, and service engineering.
All submitted abstracts will be peer-reviewed by two independent referees from the international program boards. It is anticipated that a broad range of research and applied topics will be covered during the conference. Good abstracts will be selected and be asked to provide full paper for further consideration of publication in the special issues of international journals which are indexed by EI, SCI or SSCI.
Special Issues
You are invited to submit your work reporting original achievements in areas of:
- AmI systems
- Cost and effect analysis of AmI applications
- Data analysis in AmI
- Digital human modeling
- Domestic care of the elderly, Assisted living (AmI applications)
- Health care (AmI applications)
- Human factors in AmI
- Human system interface
- Interdisciplinary aggregation architecture of AmI
- Mobile commerce
- Occupational psychology applications in AmI
- RFID applications
- Smart factory, AmI in industry (AmI applications)
- Smart home, AmI at home (AmI applications)
- Smart shops, shopping, recommender system, business (AmI applications)
- Systematic procedure for designing, analyzing, and implementing AmI applications
- Virtual museum, tour (AmI applications)
- Virtual product design, affective and pleasurable design (AmI applications)
- Others
The deadline for:
Submission abstracts November 30, 2016
Reviewer remarks January 20,2017
Registration Early bird: March 15, 2017; Regular: April 15, 2017
(Each abstract must be registered by at least one author)
Best regards,
AmI&E 2017 Organizing Committee
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